IBM, Hitachi in pact to develop tiny chips
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- March
- 10
Armonk-based IBM Corp. and Hitachi Ltd., of Tokyo, have embarked on a two-year agreement to speed the innovation of chips, marking the first time the companies have collobarated in developing semiconductors.
The companies will focus on research into the next generation of smaller chips at IBM’s Watson Research Center Yorktown Heights and at the University at Albany’s NanoTech Complex, the companies said today.
The work will focus on developing 32- and 22-nanometer semiconductors, which, the companies noted, is “at near atomic scale.”
Collaboration will help the companies develop the technology at less cost than if undertaken individually, said IBM vice president Bernie Meyerson.
“By combining individual research strength and intellectual property, we reduce the significant costs associated with research needed to advance the next generation of chip technology,” Meyerson said.
This entry was posted
on Monday, March 10th, 2008 at 4:34 pm by David Schepp.
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